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ТоварКодЦена
Heat transfer pad: ceramic; TO220; L: 12mm; W: 18mm; Thk: 1.5mmAOS220/42181.85-+
Heat transfer pad: ceramic; TO220; L: 12mm; W: 18mm; Thk: 1.5mmAOS22047991.74-+
Retaining spring; TO218,TO220,TO247,TO248,TO3PTHFU-452580.37-+
Retaining spring; TO220; FK219,FK222,SK129THF129/TO2206580.36-+
Retaining spring; TO218,TO220,TO247,TO248,TO3PTHFU-3228650.35-+
Heat transfer pad: ulTIMiFlux; TO247; L: 24.13mm; W: 19.05mmCD-02-05-2474752.36-+
Retaining spring; L: 12.5mm; H: 4mm; naturalKC-2054870.24-+
Retaining spring; L: 44mm; H: 16.3mm; naturalKC-1951600.27-+
Retaining spring; L: 45.5mm; H: 9.5mm; naturalKC-1963900.33-+
Retaining spring; L: 16.4mm; H: 4mm; naturalKC-2254690.24-+
Heat transfer pad: ulTIMiFlux; TO264; L: 26.67mm; W: 21.59mmCD-02-05-2644122.83-+
Heat transfer pad: gel; L: 300mm; W: 200mm; Thk: 0.5mm; 1.5W/mKGEL056438.57-+
Heat transfer pad: mica; TOP3; 0.4K/W; L: 20.5mm; W: 17.5mmGS/3/P4050.81-+
Retaining spring; TO220; 5.5mm; 33NTHFA310671.64-+
Heat transfer pad: Kapton; TO3; 0.15K/W; L: 42mm; W: 29mm; UL94V-0KAP/3/K562.25-+
Retaining spring; L: 37.3mm; H: 8.5mm; naturalKC-194820.36-+
Heat transfer glue; 0.836W/mK; -56÷149°C; Mix ratio: 10: 1WLK/52021.29-+
Extruded; Raspberry Pi; L: 41mm; W: 58mm; H: 35mm; black; screw; 5VDCSEE-15812257.58-+
Retaining spring; L: 30.7mm; W: 6.7mm; H: 9.3mm; natural116200F00000G26040.88-+
Insulating bushing; TO3,TOP3; 8mm; max.130°CNIPPEL-TO3168200.19-+
Heat transfer pad: silicone; TO220; 0.4K/W; L: 18mm; W: 13mmSMICA-TO22081910.26-+
Heat transfer pad: graphite; L: 103mm; W: 43mm; Thk: 0.2mm; 20W/mKEYGS0410ZLSJ410.44-+
Mount.elem: rivet; heatsink mounting; UL94V-2; D: 2.6mm; A: 6.4mmHSR-2335200.15-+
Mount.elem: rivet; heatsink mounting; UL94V-2; D: 2.5mm; A: 6.4mmHSR-2617800.15-+
Mount.elem: rivet; heatsink mounting; UL94V-2; D: 3.6mm; A: 5.5mmHSR-123000.15-+
Heat transfer pad: silicone; TO247/1; 0.4K/W; L: 24mm; W: 21mm; 10kVWS/247/115200.91-+
Insulation kit for transistors; TO3MST/31381.77-+
Heat transfer pad: silicone175-6-220P28071.79-+
Страницы: «234567 .. 7»
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