Type of board: | universal |
Board variant: | prototyping |
Board variant: | single sided |
Material: | epoxy resin |
Material: | FR4 |
Laminate thickness: | 1mm |
Width: | 60mm |
Length: | 0.1m |
Copper plating thickness: | 18µm |
Hole diameter: | 1mm |
Soldering pads configuration: | 0805 |
Soldering pads configuration: | 1206 |
Soldering pads configuration: | DIP4 |
Soldering pads configuration: | DIP6 |
Soldering pads configuration: | DIP8 |
Soldering pads configuration: | DIP10 |
Soldering pads configuration: | DIP12 |
Soldering pads configuration: | DIP14 |
Soldering pads configuration: | DIP16 |
Soldering pads configuration: | DIP18 |
Soldering pads configuration: | DIP20 |
Soldering pads configuration: | DIP22 |
Soldering pads configuration: | DIP24 |
Soldering pads configuration: | DIP28 |
Soldering pads configuration: | MELF |
Soldering pads configuration: | SMA |
Soldering pads configuration: | SMB |
Soldering pads configuration: | SMC |
Soldering pads configuration: | SO8 |
Soldering pads configuration: | SO10 |
Soldering pads configuration: | SO14 |
Soldering pads configuration: | SO16 |
Soldering pads configuration: | SO18 |
Soldering pads configuration: | SO20 |
Soldering pads configuration: | SO24 |
Soldering pads configuration: | SO28 |
Soldering pads configuration: | SOD80 |
Soldering pads configuration: | SOD87 |
Soldering pads configuration: | SOT23 |
Soldering pads configuration: | SOT89 |
Soldering pads configuration: | SOT143 |
Soldering pads configuration: | SOT223 |
Soldering pads configuration: | SOT323 |
Soldering pads pitch: | 0.7/2.54mm |
Kind of material: | fiber glass reinforced |